ANSI EIA 364 96A pdf free download
ANSI EIA 364 96A pdf free download.Plated Through Hole Integrity Test Procedure for Electrical Connectors.
3.1.2 The printed circuit board shall be of a given thickness, with finished and drilled hole size as specified. If not specified, the board shall be four layer equidistant throughout the thickness. The hole pattern annular rings shall be specified in the reference document. The two inner layers shall consist of parallel traces interconnecting all contacts in each row. The trace width shall be 0.0 10 inch (0.254 millimeter) and the trace thickness shall be 1/2 ounce (17 micrometers) copper, unless otherwise specified in the referencing document.
3.2 Preparation
3.2.1 The reference document shall specify the insertion depth of the pin into the PTH.
3.2.2 The pins shall be inserted oriented as normal for their application. If not specified the measurements shall be taken after the third insertion.
NOTE — The printed circuit board shall be adequately supported during the insertion process to minimize any flexure of the printed circuit board.
3.2.3 Five specimens shall be sectioned transversely and five shall be sectioned longitudinally unless otherwise specified.
3.2.4 The specimens should be placed in the metallurgical mounting material. It may be possible to fit more than one specimen in the same mount.
3.2.5 The reference document shall specify where the measurements are to be performed, (e.g., at the mid-plane, near the top, or bottom sections of the printed circuit board, (unless otherwise specified in the referencing document the measurement shall be taken 0.0 12 inch +0.008 / -0.004 inch ( 0.3 millimeters +0.2 / -0.1 millimeter) in from the insertion side of the board).
4 Test procedure
4.1 Radial hole distortion (transverse section)
The allowable radial hole distortion (a) of the drilled hole contour in the PTH shall have an average distortion not greater than 0.00 15 inch (37.5 micrometers) (with an absolute maximum distortion not greater than 0.002 inch (50 micrometers), unless otherwise specified in the referencing document. When viewed at the maximum magnification of 75X the remaining plating (b) shall be seen to completely separate the contact from printed wiring board non conductive matrix, thus ensuring that the contact has not penetrated completely through the hole plating, see figure 1, unless otherwise specified in the referencing document.4.2 Hole wall damage (longitudinal section) The max imum allowable distortion (c) of the connected pattern to the PTH shall be specified in the reference document. Neither the PTH nor the interconnection layer may have cracks; see figure 2. 5 Details to be specified The following details shall be specified in the referencing document: 5.1 Number of specimens, if other than 10 5.2 Printed circuit board thickness and material 5.3 Finished hole diameter, tolerance 5.4 Composition of finish in hole; e.g. copper, tin-lead, etc 5.5 Drilled hole diameter and tolerance 5.6 The PTH criteria, if other than specified in 4.1 5.7 Trace width and thickness, if other than specified in 3.1.2 5.8 Annular ring dimensions5.9 Pin insertion depth 5.10 If the PTH measurements shall be performed after the first, third, or other pin insertion, and any other special requirements to perform the test 5.11 Allowable drilled hole distortion (a), if other than specified in 4.1 5.12 Type of sections required; transverse, longitudinal, or both 5.13 Allowable internal layer stretch or distortion (c) 5.14 Other physical damage such as cracks, pad lifting, etc. that may be cause for rejection 5.15 Depth of transverse section, if other than specified in 3.2.5
ANSI EIA 364 96A pdf download.
