ANSI SP27.1 pdf free download
ANSI SP27.1 pdf free download.For the Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier l, and Semiconductor Manufacturers.
end of line test (EOL). EOL is a test method for finished products at the end of production before shipment. errata sheet. In the context of this document, an errata sheet describes known functional problems as well as deviations from the electrical specifications listed in the product description or data sheet. in circuit test (ICT). ICT is a test method for PCBAs, where the PCBA is tested for failures in circuits (for example, open or short) and for damage of the electronic component. NOTE: ICT is done after placement of the components before the PCBA is placed into a housing. look across. Look across is a process to review or evaluate a failure mode and determine if additional users are impacted. NOTE: The users could be diffrent OEM assembly plants or vehicle programs or vehicle repair faciities. Users could be different Tier 1 suppliers involving different programs or manufacturing facilities. It could also be different semi-conductor manufacturing locations, processes or equipment. module. In the context of this document a module describes the same as an ECU. printed circuit board (PCB). A non-conductive substrate with conductive tracks, pads, and other features. printed circuit board assembly (PCBA). A PCB with electronic components attached. product or production validation (PV). The validation of the electronic component or the module including the effects of automotive manufacturing variation during module and vehicle production resulting from the expected process capability or the actual process performance. root cause. The fundamental reason for the occurrence of a problem. Root Cause identifies the part or condition that needs to be changed to prevent reoccurrence. safe launch period. Initial manufacturing period, where the product is assembled and tested the first time. NOTE: The safe launch period for each tier is typically defined by a period of time (for example, 3 months) or a volume of parts produced, and may include requirements for additional or extended testing. NOTE: The safe launch period
4.0 TWO LEVEL FAILURE ANAL YSIS REPORT SUPPORT Typically, modules that are claimed to be damaged during manufacturing or use are sent back by the OEM to the Tier 1. The suspect electronic component is then sent to the semiconductor manufacturer. The semiconductor manufacturer typically has to do a failure analysis and the Tier 1 and/or the semiconductor manufacturer tries to reproduce the damage by a simulation experiment in the lab. Reproducing the damaging process can be difficult without knowledge of or access to the complex system environment and might not identify the correct damaging stress. All these actions are very costly, time consuming, and involve considerable resources of all parties. W ithout good cooperation between all tier levels, a possible stress condition that could lead to this signature may be found but not the root cause of the problem. This is especially true if the problem only randomly appears. In this case, it is almost impossible to find the root cause. To avoid an excessive amount of effort that will not result in a solution of the problem, various levels of support are defined in this Standard Practice depending on the actual situation where the damage happens (see Table 1). These levels require different information from all parties involved (OEM, Tier 1 (and sub-tiers), and semiconductor manufacturer).ANSI SP27.1 pdf download.
